The Group is well equipped with facilities for micro-fabrication. The facilities in our laboratories allow the design, fabrication and characterisation of a wide range of devices.
Design
The group has several high performance workstations for device simulation using a wide a variety of simulation packages and CAD tools.
- Comsol
- Vectorworks
- Autocad
- HFSS
- CST Microwave Studio
- NI AWR Microwave Office
- Matlab
- Layout Editor
- LinkCAD
Fabrication
The has Class 100 clean rooms contain a several chemical wet benches and a broad range of equipment that provide self-suffciency for device fabrication the facilities include:
- Deep Reactive Ion Etching (DRIE)
- Reactive Ion Etching (RIE)
- KOH etching
- HF vapour etching
- Single side and dual side lithography
- Furnaces for oxidation
- High temperature ovens
- RF sputter coating
- Evapourators
- Electroplating baths
- Rapid thermal anealling
- Freeze drying
- Wire bonding
- Laser flip chip bonding
- Solder reflow
- Dicing saw
- FDM 3D Printer
- Laser Machining
Characterisation
The characterisation facilities within the group allow for inspection during fabrication to full analysis of a device.
- LEO 1450VP Scanning Electron Beam Microsopy with EDX compositional analysis
- Zeiss Micorscopes
- Rudolph Research AutoEL®-II Automatic Ellipsometer
- Veeco Detack 3ST Surface Profiler
- Atomic Force Microscope
- Optical Surface Profiler
- Agilent 86140B and 46142B Optical Spectrum Analysers
- Hamamatsu Photonics C2400 Near-infrared Video Camera
- Agilent N5250A Perfomance Network Analyzer with RF on-wafer probe station
- THZ5B-BL T-Rad radiometer
- Four point probe resistivity measurement
OSD Cleanroom Facilities
- Laser
- Deep reactive-ion etching (DRIE)
- RIE
- UV aligners
- Evaporator
- Wire bonding
- Optical microscopes
- Profiler
- SEM
Laser
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Deep reactive-ion etching (DRIE)
RIE
UV aligners
Evaporator
Wire bonding
Optical microscopes
Profiler
SEM
