cleanroom The Group is well equipped with facilities for micro-fabrication. The facilities in our laboratories allow the design, fabrication and characterisation of a wide range of devices.

Design

The group has several high performance workstations for device simulation using a wide a variety of simulation packages and CAD tools.

  • Comsol
  • Vectorworks
  • Autocad
  • HFSS
  • CST Microwave Studio
  • NI AWR Microwave Office
  • Matlab
  • Layout Editor
  • LinkCAD

Fabrication

The has Class 100 clean rooms contain a several chemical wet benches and a broad range of equipment that provide self-suffciency for device fabrication the facilities include:

  • Deep Reactive Ion Etching (DRIE)
  • Reactive Ion Etching (RIE)
  • KOH etching
  • HF vapour etching
  • Single side and dual side lithography
  • Furnaces for oxidation
  • High temperature ovens
  • RF sputter coating
  • Evapourators
  • Electroplating baths
  • Rapid thermal anealling
  • Freeze drying
  • Wire bonding
  • Laser flip chip bonding
  • Solder reflow
  • Dicing saw 
  • FDM 3D Printer
  • Laser Machining

Characterisation

The characterisation facilities within the group allow for inspection during fabrication to full analysis of a device.

  • LEO 1450VP Scanning Electron Beam Microsopy with EDX compositional analysis
  • Zeiss Micorscopes
  • Rudolph Research AutoEL®-II Automatic Ellipsometer
  • Veeco Detack 3ST Surface Profiler
  • Atomic Force Microscope
  • Optical Surface Profiler
  • Agilent 86140B and 46142B Optical Spectrum Analysers
  • Hamamatsu Photonics C2400 Near-infrared Video Camera
  • Agilent N5250A Perfomance Network Analyzer with RF on-wafer probe station
  • THZ5B-BL T-Rad radiometer
  • Four point probe resistivity measurement

OSD Cleanroom Facilities

Laser

Deep reactive-ion etching (DRIE)

1
DRIE STS ICP
RIE

UV aligners

Evaporator

1
Evaporator
Wire bonding

1
Wire Bonder KS4526



Optical microscopes

Profiler

SEM